This is a graded product. A1 products are "as new" but have been box opened. All A1 products will be fully bubble-wrapped for transportation.
GET NEXT GEN PERFORMANCE WITH YOUR RYZEN 2ND & 3RD GEN CPUS
The GIGABYTE X570 Gaming X motherboard is a whole new chipset that utilises the best of the new 3rd Gen Ryzen CPUs with the best quality components alongside GIGABYTE R&D design capability, this is truly a motherboard to take your new ultra-fast Ryzen processors to the highest possible level. High Durability and high quality manufactured components allow the GIGABYTE X570 Gaming X to be a time-enduring centre piece of any magnificent build you decide to create. Take things up a notch with brand new incorporated PCIe 4.0 which increases the speed of your most valued components. Style your rig the way you want with integrated RGB lighting and effects. The GIGABYTE X570 motherboard range offer a rich list of features such as support for PCIe 4.0 interfaces on select boards, refined audio, high speed of Ethernet to fulfill users' performance, audio, and data transfer needs.
10 + 2 DIRECT DIGITAL POWER DESIGN
To unleash the full potential of the 3rd Generation of AMD Ryzen CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, GIGABYTE X570 Gaming X is a true beast among motherboards specifically designed for the new Ryzen series CPUs. GIGABYTE X570 motherboards use a 10+2 phase PWM + Lower RDS MOSFETs design to support the latest AMD Ryzen 3000-series CPUs by offering incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components
BRING LIFE TO YOUR DEVICES
Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With a redesigned RGB Fusion 2.0 application that provides you a better solution for customizing the lighting effects across all supported devices. From graphics cards to peripheral products, you can personalize your gaming rig with your own style and show off your build by sharing the profiles.
PROTECT YOUR COMPONENTS FROM OVERHEATING
Enlarge heatsink surface area improves thermal performance by increasing heat dissipation surface and maintain stylish aesthetic. The thick thermal pad has an improved thickness of 1.5mm and gives superior heat dissipation of MOSFETs.
NEW USER INTERFACE
GIGABYTE has specially designed the BIOS to provide users the most premium experience while constructing their new system, with a new GUI and easier to use functionalities. The BIOS is crucial for users during initial setup to allow for the most optimal settings.