Gigabyte AMD Ryzen X570 AORUS ULTRA AM4 PCIe 4.0 ATX Motherboard

TAKE YOUR RYZEN CPU TO THE NEXT LEVEL

To unleash the full potential of the new 3rd Gen Ryzen CPUs, the X570 AORUS Ultra motherboard is a whole new chipset that utilises the best CPU power design with the best quality components alongside GIGABYTE R&D design capability, this is truly a motherboard to be pairing with the new ultra-fast Ryzen processors. High Durability and high quality manufactured components allow the X570 AORUS Ultra to be a time-enduring centre piece of any magnificent build you decide to create. Take things up a notch with brand new incorporated PCIe 4.0 which increases the speed of your most valued components. Style your rig the way you want with integrated RGB lighting and effects. The GIGABYTE X570 motherboard range offer a rich list of features such as support for PCIe 4.0 and USB Type-C interfaces on select boards, refined audio, high speed of Ethernet and latest WiFi design, to fulfill users' performance, audio, and data transfer needs.

QUALITY POWER DESIGN

To unleash the full potential of the 3rd Generation of AMD Ryzen CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, X570 AORUS Ultra is a true beast among motherboards specifically designed for the new Ryzen series CPUs.

MULTI-ZONE LIGHT SHOW DESIGN

Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application that provides you a better solution for customizing the lighting effects across all supported devices. From motherboards, graphics cards to the peripheral products, you can personalize your gaming rig with your own style and show off your build by sharing the profiles.

PROTECT YOUR COMPONENTS FROM OVERHEATING

X570 AORUS Ultra uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period./p>